DIMM DDR3 8GB 1600MHz CL9 512x8 (KIT 2x4GB) ADATA XPG V3, Black

AX3U1600W4G9-DBV-RG4712366960794A-DataADATA XPG V3 DDR3 Overclocking DRAM Module applies Thermal Conductive Technology (TCT) with unique detachable fins for the ultimate cooling performance and stability when the system is in full-speed operation. It's designed as the best solution for gamers and enthusiasts thanks to high stability, compatibility, and durability.

Durable Memory with a Stylish Detachable Fin
XPG V3 is built for PC enthusiasts and gamers to pursue extreme performance. The eye-catching heat sinks and 8-layer PCBs with 2oz copper provide outstanding cooling performance and stable data transfer. An additional pair of golden fins are included in the package, making the XPG V3 more customizable. The detachable fin can be replaced by removing the screws, allowing users to exchange the fins and match the colors in their rig!

No Crash With Great Stability
XPG V3 DDR3 DRAM Module utilizes the Thermal Conductive Technology (TCT), which makes every chip have contact with the heat sinks directly, ensuring IC and PCB operate in an environment of equal temperature; therefore, XPG V3 is able to maintain the best stability, even in full-speed operation. The unique detachable fins extend the heat sinks upwards for more cooling space and generate improved cooling performance. And the 8-layer PCB with 2oz copper helps to reduce the electric resistance effectively and consume less power, which greatly enhances the integrity of signal transfer.

Extra High-Quality Chips
XPG V3 DDR3 DRAM Module is made of high-quality chips selected by a strict filtering process. It also uses top quality PCBs (Printed Circuit Board) that effectively extend the lifespan of memory modules.

Technologie paměti RAM: DDR3
Kapacita paměti RAM: 8 GB
Frekvence paměti RAM (v MHz): 1600
CAS latency: 9
Vlastnosti RAM: Pasivní chladič
Ilustrativní obrázek
ADATA XPG V3 DDR3 Overclocking DRAM Module applies Thermal Conductive Technology (TCT) with unique detachable fins for the ultimate cooling performance and stability when the system is in full speed operation. Celý popis
Ilustrativní obrázek
ilustrační obrázek
SLEVA 46%
Maloobchodní cena: 4 507 Kč, Ušetříte 2057 Kč (46 %)
2 450 Kč
2024.32 Kč bez DPH
€ 95.38
2450 Skladem, expedice do 24 hodin paměti
Dostupné:
Skladem, expedice do 24 hodin

Zboží je připraveno v našem expedičním skladu.

EAN:
4712366960794
  ks
V ceně je zahrnut recyklační poplatek.
P/N:
AX3U1600W4G9-DBV-RG
DPH:21 %
Hmotnost:0.2 kg


 
ADATA XPG V3 DDR3 Overclocking DRAM Module applies Thermal Conductive Technology (TCT) with unique detachable fins for the ultimate cooling performance and stability when the system is in full-speed operation. It's designed as the best solution for gamers and enthusiasts thanks to high stability, compatibility, and durability.
Durable Memory with a Stylish Detachable Fin
XPG V3 is built for PC enthusiasts and gamers to pursue extreme performance. The eye-catching heat sinks and 8-layer PCBs with 2oz copper provide outstanding cooling performance and stable data transfer. An additional pair of golden fins are included in the package, making the XPG V3 more customizable. The detachable fin can be replaced by removing the screws, allowing users to exchange the fins and match the colors in their rig!
No Crash With Great Stability
XPG V3 DDR3 DRAM Module utilizes the Thermal Conductive Technology (TCT), which makes every chip have contact with the heat sinks directly, ensuring IC and PCB operate in an environment of equal temperature; therefore, XPG V3 is able to maintain the best stability, even in full-speed operation. The unique detachable fins extend the heat sinks upwards for more cooling space and generate improved cooling performance. And the 8-layer PCB with 2oz copper helps to reduce the electric resistance effectively and consume less power, which greatly enhances the integrity of signal transfer.

Extra High-Quality Chips
XPG V3 DDR3 DRAM Module is made of high-quality chips selected by a strict filtering process. It also uses top quality PCBs (Printed Circuit Board) that effectively extend the lifespan of memory modules.
Technologie paměti RAM: DDR3
Kapacita paměti RAM: 8 GB
Frekvence paměti RAM (v MHz): 1600
CAS latency: 9
Vlastnosti RAM: Pasivní chladič


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